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801-83-027-10-458101

801-83-027-10-458101

801-83-027-10-458101

Preci-Dip

1 RowsSocketSolderBeryllium CopperThrough HoleBulkGoldPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled14 PositionsFemale Socket

SOT-23

801-83-027-10-458101 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 10 Weeks
Contact Material Beryllium Copper
Mounting Type Through Hole
Contact Shape Circular
Insulation Material Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Mounting Option 1 LOCKING
Operating Temperature -55°C~125°C
Packaging Bulk
Published 2012
Series 801
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Connector Type Socket
Number of Positions 14
Number of Rows 1
Fastening Type Push-Pull
Subcategory Headers and Edge Type Connectors
Contact Finish - Mating Gold
Contact Type Female Socket
Current Rating (Amps) 3A
Terminal Pitch 5.08mm
Insulation Height 0.165 4.20mm
Style Board to Board
Number of Positions Loaded All
Pitch - Mating 0.200 5.08mm
Insulation Color Black
Number of Conductors ONE
Reference Standard UL
Reliability COMMERCIAL
Body Length or Diameter 5.3 inch
Contact Length - Post 0.125 3.18mm
Number Of PCB Rows 1
Contact Finish - Post Tin
PCB Contact Pattern RECTANGULAR
Mating Contact Pitch 0.2 inch
Polarization Key POLAR PIN POSITION
Durability 500 Cycles
Plating Thickness 30μin
Contact Finish Thickness - Mating 29.5μin 0.75μm
Material Flammability Rating UL94 V-0
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
300 $1.61060 $483.18
801-83-027-10-458101 Product Details

801-83-027-10-458101 Overview


The packaging contains Socket.This device's mounting type is Through Hole.A Bulk case is used to package the product.801 Series product.Devices operate at -55°C~125°C operating temperatures.

801-83-027-10-458101 Features


801 series

801-83-027-10-458101 Applications


There are a lot of Preci-Dip 801-83-027-10-458101 Rectangular Connectors applications.

  • Transportation
  • Industrial Automation
  • Embedded systems
  • Telecommunications
  • Communication
  • Medical technology
  • Data Technology
  • Automotive Electronics
  • Military Technology
  • Datacom

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