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801-87-014-10-005101

801-87-014-10-005101

801-87-014-10-005101

Preci-Dip

1 RowsSocketSolderBeryllium CopperThrough HoleBulkGoldPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled14 PositionsFemale Socket

SOT-23

801-87-014-10-005101 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 10 Weeks
Contact Material Beryllium Copper
Mount Through Hole
Mounting Type Through Hole
Package / Case SIP
Contact Shape Circular
Insulation Material Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Housing Material Polychlorinated
Operating Temperature -55°C~125°C
Packaging Bulk
Published 2012
Series 801
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Connector Type Socket
Number of Positions 14
Number of Rows 1
Gender Female
Fastening Type Push-Pull
Contact Finish - Mating Gold
Contact Type Female Socket
Orientation Straight
Depth 2.54mm
Insulation Height 0.335 8.51mm
Style Board to Board
Number of Positions Loaded All
Pitch - Mating 0.100 2.54mm
Contact Length - Post 0.118 3.00mm
Contact Finish - Post Tin
Housing Color Black
Contact Resistance 10mOhm
Max Voltage Rating (AC) 100V
Max Current Rating 3A
Length 35.56mm
Contact Finish Thickness - Mating Flash
Material Flammability Rating UL94 V-0
Radiation Hardening No
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
800 $1.03965 $831.72
801-87-014-10-005101 Product Details

801-87-014-10-005101 Overview


Packaging is Socket.Mounting type Through Hole is assigned to the device.To package the product, a Bulk case is used.Specifically, it is one of the products in the 801 Series.SIP refers to a package enclosing a device.This part is mounted by Through Hole. -55°C~125°C Operating Temperature is used by the device.

801-87-014-10-005101 Features


801 series

801-87-014-10-005101 Applications


There are a lot of Preci-Dip 801-87-014-10-005101 Rectangular Connectors applications.

  • Data Technology
  • Transportation
  • Communication
  • Measuring & Control Technology
  • Datacom
  • Instrumentation
  • Telecommunications
  • Medical technology
  • Embedded systems
  • Industrial Automation

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