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831-83-014-10-230101

831-83-014-10-230101

831-83-014-10-230101

Preci-Dip

1 RowsSocketKinked Pin, SolderBeryllium CopperThrough HoleBulkGoldLiquid Crystal Polymer (LCP), Glass Filled14 PositionsFemale Socket

SOT-23

831-83-014-10-230101 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 10 Weeks
Contact Material Beryllium Copper
Mount Through Hole
Mounting Type Through Hole
Contact Shape Circular
Insulation Material Liquid Crystal Polymer (LCP), Glass Filled
Operating Temperature -55°C~125°C
Packaging Bulk
Published 2012
Series 831
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Kinked Pin, Solder
Connector Type Socket
Number of Positions 14
Number of Rows 1
Fastening Type Push-Pull
Subcategory Headers and Edge Type Connectors
Contact Finish - Mating Gold
Contact Type Female Socket
Current Rating (Amps) 3A
Terminal Pitch 2.0066mm
Insulation Height 0.165 4.20mm
Style Board to Board
Number of Positions Loaded All
Pitch - Mating 0.079 2.00mm
Insulation Color Black
Number of Conductors ONE
Reference Standard UL
Reliability COMMERCIAL
Contact Length - Post 0.122 3.10mm
Number Of PCB Rows 1
Contact Finish - Post Tin
PCB Contact Pattern RECTANGULAR
Body Breadth 0.087 inch
Mating Contact Pitch 0.079 inch
Polarization Key POLARIZED HOUSING
Durability 500 Cycles
Plating Thickness 30μin
Contact Finish Thickness - Mating 29.5μin 0.75μm
Material Flammability Rating UL94 V-0
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
360 $1.35883 $489.1788
831-83-014-10-230101 Product Details

831-83-014-10-230101 Overview


It comes in Socket packaging.Through Hole indicates that the device is mounted.An orange Bulk case is used to package the product.831 Series product.Through Hole mounts the part.This device operates at a temperature of -55°C~125°C.

831-83-014-10-230101 Features


831 series

831-83-014-10-230101 Applications


There are a lot of Preci-Dip 831-83-014-10-230101 Rectangular Connectors applications.

  • Transportation
  • Automotive Electronics
  • Embedded systems
  • Datacom
  • Data Technology
  • Telecommunications
  • Measuring & Control Technology
  • Military Technology
  • Industrial Automation
  • Instrumentation

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