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831-87-041-64-001101

831-87-041-64-001101

831-87-041-64-001101

Preci-Dip

1 RowsSocketPress-Fit, SolderBeryllium CopperThrough HoleBulkGoldLiquid Crystal Polymer (LCP), Glass Filled41 PositionsFemale Socket

SOT-23

831-87-041-64-001101 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 10 Weeks
Contact Material Beryllium Copper
Mount Through Hole
Mounting Type Through Hole
Contact Shape Circular
Insulation Material Liquid Crystal Polymer (LCP), Glass Filled
Operating Temperature -55°C~125°C
Packaging Bulk
Published 2012
Series 831
JESD-609 Code e3
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Press-Fit, Solder
ECCN Code EAR99
Connector Type Socket
Number of Positions 41
Number of Rows 1
Additional Feature STANDARD: UL 94V-0
HTS Code 8536.69.40.40
Fastening Type Push-Pull
Contact Finish - Mating Gold
Contact Type Female Socket
Current Rating (Amps) 3A
Insulation Height 0.165 4.20mm
Style Board to Board
Number of Positions Loaded All
Pitch - Mating 0.079 2.00mm
Insulation Color Black
Contact Length - Post 0.098 2.50mm
Number of Contacts 41
Contact Finish - Post Tin
Contact Finish Thickness - Mating Flash
Material Flammability Rating UL94 V-0
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
90 $5.92744 $533.4696
831-87-041-64-001101 Product Details

831-87-041-64-001101 Overview


This product is packaged in a Socket carton.This device has a mounting type of Through Hole.We use a Bulk case to package the product.This product is part of the 831 Series.Furthermore, there are other features such as STANDARD: UL 94V-0, to name a few.Through Hole represents the mounting point for the part.The device is operating at -55°C~125°C Operating Temperature.

831-87-041-64-001101 Features


831 series

831-87-041-64-001101 Applications


There are a lot of Preci-Dip 831-87-041-64-001101 Rectangular Connectors applications.

  • Transportation
  • Military Technology
  • Data Technology
  • Automotive Electronics
  • Industrial Automation
  • Telecommunications
  • Medical technology
  • Instrumentation
  • Embedded systems
  • Datacom

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