CYP15G0401RB-BGC Overview

To save board space, the 256-LBGA Exposed Pad package is used.For telecommunications equipment packing, the Tray method is used.There is a type Surface Mount mount for this telecom circuit.4 circuits are used in this telecom IC .3.135V~3.465V can be supplied wtelecom IC's efficiencyh a voltage that enhances efficiency.A temperature setting of 0°C~70°C ensures reliable performance.The configuration includes 256 terminations.The voltage it operates at is 3.3V.It uses a TELECOM CIRCUIT type telecom IC.Telecom equipment operates wit h a supply current of 640mA.This part can perform many functions similar to the electronic parts under the HOTlink II? series.

CYP15G0401RB-BGC Features

Available in the 256-LBGA Exposed Pad package
TELECOM CIRCUIT as telecom IC type

CYP15G0401RB-BGC Applications

There are a lot of Rochester Electronics, LLC CYP15G0401RB-BGC Telecom applications.

• T1/E1/J1 LAN/WAN Routers
• Multi-Line E1 Interface Cards
• Interfaces to SONET STS-1 Networks
• LAN Routers
• T1/E1/J1 add/drop multiplexers (MUX)
• DECT (Digital European Cordless Telephone) Base Stations
• E1 Rates PCM Line Interface
• T1 Rates PCM Line Interface
• Fiber to the Home (FTTH)
• T3 channelized access concentrators