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SI32170-C-FM1

SI32170-C-FM1

SI32170-C-FM1

Silicon Labs

42 Terminations3.3V Telecom device1 Circuits

SOT-23

SI32170-C-FM1 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 8 Weeks
Mounting Type Surface Mount
Package / Case 42-VFQFN Exposed Pad
Surface Mount YES
Operating Temperature 0°C~70°C
Packaging Tray
Published 1993
Series ProSLIC®
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 42
Power (Watts) 750mW
Voltage - Supply 3.13V~3.47V
Terminal Position BOTTOM
Terminal Form BUTT
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 3.3V
Terminal Pitch 0.5mm
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-XBCC-B42
Function Subscriber Line Interface Concept (SLIC), CODEC
Operating Supply Voltage 3.3V
Interface PCM, SPI
Number of Circuits 1
Telecom IC Type TELECOM CIRCUIT
Height Seated (Max) 0.9mm
Length 7mm
Width 5mm
RoHS Status RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
364 $4.63049 $1685.49836
SI32170-C-FM1 Product Details

SI32170-C-FM1 Overview


Board space can be saved by using the 42-VFQFN Exposed Pad package.In order to pack telecommunications equipment, Tray is used.A Surface Mount mounting type is used.1 circuits are used in this telecom IC .The voltage supplied to 3.13V~3.47V can improve efficiency.Operating temperatures of 0°C~70°C can ensure reliable performance.42 terminations can be found in the configuration.It operates at voltage 3.3V.Telecom ICs are of type TELECOM CIRCUIT.To offer designers much flexibility, it is powered by 3.3V voltage.A lot of its functions of the telecommunication product are similar to those of the electronic parts in the ProSLIC? series.

SI32170-C-FM1 Features


Available in the 42-VFQFN Exposed Pad package
TELECOM CIRCUIT as telecom IC type
Operating supply voltage of 3.3V

SI32170-C-FM1 Applications


There are a lot of Silicon Labs SI32170-C-FM1 Telecom applications.

  • High speed data transmission line cards
  • T3 channelized access concentrators
  • SONET/SDH terminal
  • ISDN Primary Rate Interfaces (PRA)
  • CSU/DSU E1 Interface
  • Stations
  • Voice over packet gateways
  • Integrated Multi-Service Access Platforms (IMAPs)
  • Wireless local loop (WLL)
  • Dual battery supply voltage SLICs

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