LFE3-70E-7FN672I Overview

Fpga chips is supplied in the 672-BBGA package. A total of 380 I/Os are programmed to ensure a more coherent data transfer. A fundamental building block is made up of 67000 logic elements/cells. By attaching the Surface Mount connector, you can use this FPGA module with your development board. In order for it to operate, the supply voltage must be 1.14V~1.26V . The ECP3 series FPGA is a type of FPGA that belongs to the ECP3 family of FPGAs. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range -40°C~100°C TJ while the machine is operating. Using the Tray layout, this FPGA model can be contained in a very small amount of space. There are 4526080 RAM bits that are available with this device. This FPGA is built as an array of 8375 LABs/CLBs. The supplier of the device package is 672-FPBGA (27x27).

LFE3-70E-7FN672I Features

380 I/Os
Up to 4526080 RAM bits

LFE3-70E-7FN672I Applications

There are a lot of Rochester Electronics, LLC LFE3-70E-7FN672I FPGAs applications.

• Embedded Vision
• Medical imaging
• Scientific Instruments
• Image processing
• Automotive Applications
• Video & Image Processing
• OpenCL
• Automotive
• Filtering and communication encoding
• Radar and Sensors