OMAPL137BZKBA3 Overview

With a packing size of 256-BGA, this embedded microprocessor is ideal for international shipping. High reliability is achieved with advanced packaging method Tray. CPUs have 1 Core 32-Bit cores/bus width. Be aware of the operating temperature around -40°C~105°C TJ. A OMAP-L1x series item. A ARM926EJ-S processor is present in this CPU. The CPU contains SDRAM RAM controllers. This microprocessor is equipped with an interface of HPI, I2C, McASP, MMC/SD, SPI, UART. 1.8V 3.3V is the CPU's I/O address. A supplier offers a 256-BGA (17x17) package.

OMAPL137BZKBA3 Features

ARM926EJ-S Core

OMAPL137BZKBA3 Applications

There are a lot of Rochester Electronics, LLC
OMAPL137BZKBA3 Microprocessor applications.

• Radio
• Television
• Heater/Fan
• Calculator
• Kindle
• Christmas lights
• 3D printers
• Washing machine
• Microwave ovens
• Home appliances