BSM300D12P2E001

new-10%

Manufacturer part number:BSM300D12P2E001

Manufacturer:ROHM Semiconductor

Description:MOSFET 2N-CH 1200V 300A

Case Package:SOT-23

Datasheet:BSM300D12P2E001 Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
Factory Lead Time	25 Weeks
Mount	Surface Mount
Mounting Type	Chassis Mount
Package / Case	Module
Operating Temperature	-40°C~150°C TJ
Packaging	Tray
Published	2015
Part Status	Active
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Number of Terminations	11
ECCN Code	EAR99
Max Power Dissipation	1.875kW
Terminal Position	UPPER
Terminal Form	UNSPECIFIED
Peak Reflow Temperature (Cel)	NOT SPECIFIED
Reach Compliance Code	not_compliant
[email protected] Reflow Temperature-Max (s)	NOT SPECIFIED
JESD-30 Code	R-XUFM-X11
Number of Elements	2
Configuration	SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR
Operating Mode	ENHANCEMENT MODE
Case Connection	ISOLATED
Power - Max	1875W
FET Type	2 N-Channel (Half Bridge)
Transistor Application	SWITCHING
Vgs(th) (Max) @ Id	4V @ 68mA
Input Capacitance (Ciss) (Max) @ Vds	35000pF @ 10V
Current - Continuous Drain (Id) @ 25°C	300A Tc
Drain to Source Voltage (Vdss)	1200V 1.2kV
Continuous Drain Current (ID)	300A
Pulsed Drain Current-Max (IDM)	600A
DS Breakdown Voltage-Min	1200V
FET Technology	METAL-OXIDE SEMICONDUCTOR
FET Feature	Silicon Carbide (SiC)
RoHS Status	ROHS3 Compliant