M393B2G70QH0-YK0

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Manufacturer part number:M393B2G70QH0-YK0

Manufacturer:Samsung Electronics

Description:M393B2G70QH0-YK0 datasheet pdf and Memory Cards product details from Samsung Electronics stock available on our website

Case Package:SOT-23

Datasheet:M393B2G70QH0-YK0 Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
Surface Mount	NO
Number of Terminals	240
ECCN (US)	4A994.a
HTS	8542.32.00.02
Module	DRAM Module
Module Density	16Gbyte
Number of Chip per Module	36
Chip Density (bit)	4G
Data Bus Width (bit)	72
Max. Access Time (ns)	20
Maximum Clock Rate (MHz)	670
Chip Configuration	1Gx4
Chip Package Type	FBGA
Minimum Operating Supply Voltage (V)	1.28/1.425
Typical Operating Supply Voltage (V)	1.35/1.5
Maximum Operating Supply Voltage (V)	1.45/1.575
Operating Current (mA)	2800
Minimum Operating Temperature (°C)	0
Maximum Operating Temperature (°C)	95
Module Sides	Double
ECC Support	Yes
Number of Ranks	Dual
CAS Latency	11
SPD EEPROM Support	Yes
Standard Package Name	DIMM
Supplier Package	RDIMM
Mounting	Socket
Package Height	30
Package Length	133.35
Package Width	4(Max)
PCB changed	240
Lead Shape	No Lead
Number of Words	2147483648 words
Package Shape	RECTANGULAR
Manufacturer	Samsung Semiconductor
Part Status	Obsolete
Additional Feature	AUTO/SELF REFRESH; ALSO OPERATES AT 1.5V SUPPLY; WD-MAX
Technology	CMOS
Terminal Position	DUAL
Terminal Form	NO LEAD
Peak Reflow Temperature (Cel)	NOT SPECIFIED
Number of Functions	1
Terminal Pitch	1 mm
Reach Compliance Code	compliant
Pin Count	240
JESD-30 Code	R-XDMA-N240
Supply Voltage-Max (Vsup)	1.45 V
Temperature Grade	OTHER
Supply Voltage-Min (Vsup)	1.283 V
Number of Ports	1
Operating Mode	SYNCHRONOUS
Organization	2Gx72
Seated Height-Max	30.15 mm
Memory Width	72
Memory Density	154618822656 bit
PLL	No
Memory IC Type	DDR DRAM MODULE
Access Mode	DUAL BANK PAGE BURST
Self Refresh	Yes
Module Type	240RDIMM
Width	4 mm
Length	133.35 mm
RoHS Status	RoHS Compliant