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M386A8K40BM1-CRC4Q

M386A8K40BM1-CRC4Q

M386A8K40BM1-CRC4Q

Samsung Electronics

M386A8K40BM1-CRC4Q datasheet pdf and Memory Cards product details from Samsung Electronics stock available on our website

SOT-23

M386A8K40BM1-CRC4Q Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
ECCN (US) 4A994.a
HTS 8473.30.11.40
Module DRAM Module
Module Density 64Gbyte
Number of Chip per Module 36
Chip Density (bit) 16G
Data Bus Width (bit) 72
Maximum Clock Rate (MHz) 2400
Chip Configuration 4Gx4
Chip Package Type FBGA
Typical Operating Supply Voltage (V) 1.2
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 95
Supplier Temperature Grade Commercial
ECC Support No
Number of Ranks Quad
Number of Chip Banks 16
CAS Latency 15
Supplier Package LRDIMM
Mounting Socket
PCB changed 288
Part Status LTB
Pin Count 288
Organization 8Gx72
Module Type 288RDIMM
RoHS Status Yes with exemptions

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