M393B2G70QH0-YK008

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Manufacturer part number:M393B2G70QH0-YK008

Manufacturer:Samsung Electronics

Description:M393B2G70QH0-YK008 datasheet pdf and Memory Cards product details from Samsung Electronics stock available on our website

Case Package:SOT-23

Datasheet:M393B2G70QH0-YK008 Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
ECCN (US)	4A994.a
HTS	8542.32.00.36
Module	DRAM Module
Module Density	16Gbyte
Number of Chip per Module	36
Chip Density (bit)	4G
Data Bus Width (bit)	72
Max. Access Time (ns)	20
Maximum Clock Rate (MHz)	670
Chip Configuration	1Gx4
Chip Package Type	FBGA
Minimum Operating Supply Voltage (V)	1.28/1.425
Typical Operating Supply Voltage (V)	1.35/1.5
Maximum Operating Supply Voltage (V)	1.45/1.575
Operating Current (mA)	2800
Minimum Operating Temperature (°C)	0
Maximum Operating Temperature (°C)	95
Module Sides	Double
ECC Support	Yes
Number of Ranks	Dual
CAS Latency	11
SPD EEPROM Support	Yes
Standard Package Name	DIMM
Supplier Package	RDIMM
Mounting	Socket
Package Height	30
Package Length	133.35
Package Width	4(Max)
PCB changed	240
Lead Shape	No Lead
Part Status	Obsolete
Pin Count	240
Organization	2Gx72
PLL	No
Self Refresh	Yes
Module Type	240RDIMM
RoHS Status	RoHS Compliant