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FHP-05-01-T-S

FHP-05-01-T-S

FHP-05-01-T-S

Samtec Inc.

1 RowsReceptacleSolderPhosphor BronzeThrough HoleTubeTinLiquid Crystal Polymer (LCP)Female Socket

SOT-23

FHP-05-01-T-S Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 3 Weeks
Contact Material Phosphor Bronze
Mount Through Hole
Mounting Type Through Hole
Contact Shape Square
Insulation Material Liquid Crystal Polymer (LCP)
Housing Material Polymer
Operating Temperature -55°C~105°C
Packaging Tube
Published 2000
Series FHP
JESD-609 Code e3
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
ECCN Code EAR99
Connector Type Receptacle
Number of Rows 1
Fastening Type Push-Pull
Contact Finish - Mating Tin
MIL Conformance NO
DIN Conformance NO
IEC Conformance NO
Filter Feature NO
Contact Type Female Socket
Mixed Contacts NO
Option GENERAL PURPOSE
Orientation Straight
Depth 5.08mm
Insulation Height 0.350 8.89mm
Style Board to Board
Number of Positions Loaded All
Pitch - Mating 0.156 3.96mm
Contact Length - Post 0.102 2.60mm
Number of Contacts 5
Housing Color Black
Empty Shell NO
Length 19.8mm
Width 5.08mm
Radiation Hardening No
REACH SVHC No SVHC
RoHS Status ROHS3 Compliant
Lead Free Lead Free
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $3.555480 $3.55548
10 $3.354226 $33.54226
100 $3.164364 $316.4364
500 $2.985250 $1492.625
1000 $2.816273 $2816.273
FHP-05-01-T-S Product Details

FHP-05-01-T-S Overview


Receptacle packaging is included.Through Hole is the mounting type of the device.An orange Tube case is used to package the product.The product is a member of the FHP Series.By Through Hole, the part is mounted.This device operates at a temperature of -55°C~105°C.

FHP-05-01-T-S Features


FHP series

FHP-05-01-T-S Applications


There are a lot of Samtec Inc. FHP-05-01-T-S Rectangular Connectors applications.

  • Instrumentation
  • Communication
  • Military Technology
  • Industrial Automation
  • Measuring & Control Technology
  • Datacom
  • Telecommunications
  • Automotive Electronics
  • Embedded systems
  • Transportation

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