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HLE-116-02-F-DV-TE

HLE-116-02-F-DV-TE

HLE-116-02-F-DV-TE

Samtec Inc.

2 RowsReceptacleSolderBeryllium CopperThrough HoleTubeGoldLiquid Crystal Polymer (LCP)32 PositionsFemale Socket

SOT-23

HLE-116-02-F-DV-TE Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 3 Weeks
Contact Material Beryllium Copper
Mounting Type Through Hole
Contact Shape Square
Insulation Material Liquid Crystal Polymer (LCP)
Operating Temperature -55°C~125°C
Packaging Tube
Series HLE
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) Not Applicable
Termination Solder
Connector Type Receptacle
Number of Positions 32
Number of Rows 2
Voltage - Rated 400VAC
Additional Feature TIGER BEAM CONTACT; TOP ENTRY
Fastening Type Push-Pull
Contact Finish - Mating Gold
MIL Conformance NO
DIN Conformance NO
IEC Conformance NO
Filter Feature NO
Contact Type Female Socket
Mixed Contacts NO
Option GENERAL PURPOSE
Current Rating (Amps) 4.1A per Contact
Insulation Height 0.138 3.50mm
Style Board to Board
Number of Positions Loaded All
Pitch - Mating 0.100 2.54mm
Insulation Color Black
Row Spacing - Mating 0.100 (2.54mm)
Contact Length - Post 0.120 3.05mm
Contact Finish - Post Tin
Contact Finish Thickness - Mating 3.00μin 0.076μm
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $3.67000 $3.67
HLE-116-02-F-DV-TE Product Details

HLE-116-02-F-DV-TE Overview


The product comes in a package of Receptacle.A Through Hole mounting type is specified for the device.A Tube case is used for packaging.It's from the HLE Series.Then there's TIGER BEAM CONTACT; TOP ENTRY, for example.The device is operating at -55°C~125°C Operating Temperature.

HLE-116-02-F-DV-TE Features


HLE series

HLE-116-02-F-DV-TE Applications


There are a lot of Samtec Inc. HLE-116-02-F-DV-TE Rectangular Connectors applications.

  • Medical technology
  • Military Technology
  • Communication
  • Datacom
  • Data Technology
  • Automotive Electronics
  • Measuring & Control Technology
  • Transportation
  • Telecommunications
  • Embedded systems

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