HDAF-11-18.0-S-13-1

new-10%

Manufacturer part number:HDAF-11-18.0-S-13-1

Manufacturer:Samtec Inc.

Description:CONN HD ARRAY RCPT 143P SMD GOLD

Case Package:SOT-23

Datasheet:HDAF-11-18.0-S-13-1 Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
Factory Lead Time	3 Weeks
Contact Material	Copper
Mount	Surface Mount
Mounting Type	Surface Mount
Insulation Material	LIQUID CRYSTAL POLYMER (LCP)
Packaging	Tray
Series	HD Mezz™ HDAF
JESD-609 Code	e3
Feature	Board Guide
Pbfree Code	no
Part Status	Active
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Termination	Solder
Connector Type	High Density Array, Female
Number of Positions	143
Color	Black
Number of Rows	13
Gender	Receptacle
Subcategory	Headers and Edge Type Connectors
MIL Conformance	NO
DIN Conformance	NO
IEC Conformance	NO
Filter Feature	NO
Mixed Contacts	NO
Option	GENERAL PURPOSE
Pitch	0.047 1.20mm
Total Number of Contacts	143
Current Rating	2.3A
Number of Conductors	ONE
Reference Standard	UL
Contact Finish	Gold
Voltage - Rated AC	200V
Reliability	COMMERCIAL
Body Length or Diameter	1.572 inch
Number Of PCB Rows	13
PCB Contact Pattern	RECTANGULAR
Operating Temperature (Max)	125°C
Mating Information	MULTIPLE MATING PARTS AVAILABLE
Body Breadth	0.886 inch
Operating Temperature (Min)	-55°C
Body Depth	0.807 inch
Rated Current (Signal)	1.8A
Contact Resistance	19mOhm
Insulation Resistance	5000000000Ohm
Row Spacing	2 mm
Dielectric Withstanding Voltage	700VAC V
Durability	100 Cycles
Contact Pattern	RECTANGULAR
Contact Finish Thickness	30.0μin 0.76μm
Plating Thickness	30μin
Height Above Board	0.807 20.51mm
Stack Height (Mating)	30mm 35mm
Radiation Hardening	No
REACH SVHC	No SVHC
RoHS Status	ROHS3 Compliant