HDAF-23-08.0-S-13-2-P

new-10%

Manufacturer part number:HDAF-23-08.0-S-13-2-P

Manufacturer:Samtec Inc.

Description:Conn Elevated Array Terminal SKT 299 POS 2mm Solder ST SMD

Case Package:SOT-23

Datasheet:HDAF-23-08.0-S-13-2-P Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
Factory Lead Time	3 Weeks
Contact Material	COPPER ALLOY
Mounting Type	Surface Mount
Insulation Material	LIQUID CRYSTAL POLYMER (LCP)
Mounting Option 1	LOCKING
Board Mounting Option	PEG
Packaging	Tray
Series	HD Mezz™ HDAF
JESD-609 Code	e3
Feature	Board Guide, Pick and Place
Pbfree Code	yes
Part Status	Active
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Termination	Solder
Connector Type	High Density Array, Female
Number of Positions	299
Number of Rows	13
Gender	Female
Subcategory	Headers and Edge Type Connectors
MIL Conformance	NO
DIN Conformance	NO
IEC Conformance	NO
Filter Feature	NO
Mixed Contacts	NO
Option	GENERAL PURPOSE
Pitch	0.047 1.20mm
Total Number of Contacts	299
Number of Conductors	ONE
Reference Standard	UL
Contact Finish	Gold
Reliability	COMMERCIAL
Body Length or Diameter	2.517 inch
Number Of PCB Rows	13
PCB Contact Pattern	RECTANGULAR
Operating Temperature (Max)	125°C
Mating Information	MULTIPLE MATING PARTS AVAILABLE
Body Breadth	0.886 inch
Operating Temperature (Min)	-55°C
Body Depth	0.414 inch
Rated Current (Signal)	1.8A
Contact Resistance	15mOhm
Insulation Resistance	5000000000Ohm
Body/Shell Style	SOCKET
Dielectric Withstanding Voltage	700VAC V
PCB Contact Row Spacing	1.1938 mm
Durability	100 Cycles
Contact Pattern	RECTANGULAR
Insulator Color	BLACK
Contact Finish Thickness	30.0μin 0.76μm
Plating Thickness	30μin
Height Above Board	0.414 10.51mm
Stack Height (Mating)	20mm 25mm
Radiation Hardening	No
RoHS Status	ROHS3 Compliant