High Density Array, Male Tray 13 Rows 0.047 1.20mm Surface Mount 143 Positions HD Mezz™ HDAM Gold Solder Copper
SOT-23
HDAM-11-12.0-S-13-1 Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
3 Weeks
Contact Material
Copper
Mount
Surface Mount
Mounting Type
Surface Mount
Packaging
Tray
Series
HD Mezz™ HDAM
JESD-609 Code
e3
Feature
Board Guide
Pbfree Code
no
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Termination
Solder
Connector Type
High Density Array, Male
Number of Positions
143
Color
Black
Number of Rows
13
Gender
Male
Additional Feature
HD MEZZ, HIGH DENSITY
MIL Conformance
NO
DIN Conformance
NO
IEC Conformance
NO
Filter Feature
NO
Mixed Contacts
NO
Option
GENERAL PURPOSE
Pitch
0.047 1.20mm
Total Number of Contacts
143
Current Rating
2.3A
Contact Finish
Gold
Voltage - Rated AC
200V
Mating Information
MULTIPLE MATING PARTS AVAILABLE
Contact Resistance
19mOhm
Row Spacing
2 mm
Contact Finish Thickness
30.0μin 0.76μm
Height Above Board
0.683 17.35mm
Stack Height (Mating)
20mm 30mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1
$21.70000
$21.7
HDAM-11-12.0-S-13-1 Product Details
HDAM-11-12.0-S-13-1 Overview
Currently, it is packaged in High Density Array, Male.A Tray case is used to package the product.The mounting type of the device is Surface Mount.A product of the HD Mezz™ HDAM Series, it belongs to the range of products of that series.The operating system can be configured to maintain the value of Board Guide when it operates.Using a Surface Mount socket is required in order to mount the item.Furthermore, there are other features available, such as HD MEZZ, HIGH DENSITY, to name a few.
HDAM-11-12.0-S-13-1 Features
HD Mezz™ HDAM series Package / Case: Tray Mounting Type:Surface Mount Additional Feature: HD MEZZ, HIGH DENSITY
HDAM-11-12.0-S-13-1 Applications
There are a lot of Samtec Inc. HDAM-11-12.0-S-13-1 Rectangular Connectors applications.