HTSW-108-08-F-D-RA-003

new-10%

Manufacturer part number:HTSW-108-08-F-D-RA-003

Manufacturer:Samtec Inc.

Description:Conn Unshrouded Header HDR 16 POS 2.54mm Solder RA Thru-Hole

Case Package:SOT-23

Datasheet:HTSW-108-08-F-D-RA-003 Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
Factory Lead Time	3 Weeks
Contact Material	Phosphor Bronze
Mount	Through Hole
Mounting Type	Through Hole, Right Angle
Contact Shape	Square
Insulation Material	Liquid Crystal Polymer (LCP)
Operating Temperature	-55°C~125°C
Packaging	Bulk
Published	2016
Series	HTSW
JESD-609 Code	e3
Part Status	Active
Moisture Sensitivity Level (MSL)	Not Applicable
Termination	Solder
Connector Type	Header
Number of Positions	16
Number of Rows	2
Gender	Male
Fastening Type	Push-Pull
Contact Finish - Mating	Gold
Contact Type	Male Pin
Current Rating (Amps)	Varies by WireGAuge
Insulation Height	0.240 6.10mm
Style	Board to Board or Cable
Number of Positions Loaded	15
Pitch - Mating	0.100 2.54mm
Insulation Color	Natural
Number of Conductors	ONE
Reliability	COMMERCIAL
Body Length or Diameter	0.8 inch
Row Spacing - Mating	0.100 (2.54mm)
Contact Length - Post	0.090 2.29mm
Shrouding	Unshrouded
Number Of PCB Rows	2
Lead Pitch	2.54mm
Contact Finish - Post	Tin
Contact Length - Mating	0.230 5.84mm
PCB Contact Pattern	RECTANGULAR
Mating Contact Pitch	0.1 inch
Contact Finish Thickness - Mating	3.00μin 0.076μm
Material Flammability Rating	UL94 V-0
RoHS Status	ROHS3 Compliant