HTSW-109-08-T-D-RA

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HTSW-109-08-T-D-RA

Manufacturer part number:HTSW-109-08-T-D-RA

Manufacturer:Samtec Inc.

Description:HTSW Series 2-Row Header Solder Phosphor Bronze Bulk Through Hole, Right Angle Tin Liquid Crystal Polymer (LCP) 18-Position Board to Board or Cable 0.240 6.10mm Height

Case Package:SOT-23

Datasheet:HTSW-109-08-T-D-RA Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
Factory Lead Time	3 Weeks
Contact Material	Phosphor Bronze
Mount	Through Hole
Mounting Type	Through Hole, Right Angle
Contact Shape	Square
Insulation Material	Liquid Crystal Polymer (LCP)
Operating Temperature	-55°C~105°C
Packaging	Bulk
Published	2005
Series	HTSW
JESD-609 Code	e3
Pbfree Code	yes
Part Status	Active
Moisture Sensitivity Level (MSL)	Not Applicable
Termination	Solder
Connector Type	Header
Number of Positions	18
Number of Rows	2
Gender	Male
Fastening Type	Push-Pull
Contact Finish - Mating	Tin
MIL Conformance	NO
DIN Conformance	NO
IEC Conformance	NO
Filter Feature	NO
Contact Type	Male Pin
Mixed Contacts	NO
Option	GENERAL PURPOSE
Current Rating (Amps)	Varies by WireGAuge
Insulation Height	0.240 6.10mm
Style	Board to Board or Cable
Number of Positions Loaded	All
Pitch - Mating	0.100 2.54mm
Insulation Color	Natural
Number of Conductors	ONE
Reliability	COMMERCIAL
Body Length or Diameter	0.9 inch
Row Spacing - Mating	0.100 (2.54mm)
Contact Length - Post	0.090 2.29mm
Shrouding	Unshrouded
Number Of PCB Rows	2
Lead Pitch	2.54mm
Contact Length - Mating	0.230 5.84mm
PCB Contact Pattern	RECTANGULAR
Mating Contact Pitch	0.1 inch
Material Flammability Rating	UL94 V-0
Radiation Hardening	No
REACH SVHC	No SVHC
RoHS Status	ROHS3 Compliant