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HTSW-110-08-G-D-RA-008

HTSW-110-08-G-D-RA-008

HTSW-110-08-G-D-RA-008

Samtec Inc.

CONN HEADER R/A 20POS 2.54MM

SOT-23

HTSW-110-08-G-D-RA-008 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 3 Weeks
Contact Material Phosphor Bronze
Mounting Type Through Hole, Right Angle
Contact Shape Square
Insulation Material Liquid Crystal Polymer (LCP)
Operating Temperature -55°C~125°C
Packaging Bulk
Series HTSW
JESD-609 Code e4
Part Status Active
Moisture Sensitivity Level (MSL) Not Applicable
Termination Solder
Connector Type Header
Number of Positions 20
Number of Rows 2
Fastening Type Push-Pull
Contact Finish - Mating Gold
Contact Type Male Pin
Current Rating (Amps) Varies by WireGAuge
Insulation Height 0.240 6.10mm
Style Board to Board or Cable
Number of Positions Loaded 19
Pitch - Mating 0.100 2.54mm
Insulation Color Natural
Number of Conductors ONE
Reliability COMMERCIAL
Body Length or Diameter 1 inch
Row Spacing - Mating 0.100 (2.54mm)
Contact Length - Post 0.090 2.29mm
Shrouding Unshrouded
Number Of PCB Rows 2
Lead Pitch 2.54mm
Contact Length - Mating 0.230 5.84mm
PCB Contact Pattern RECTANGULAR
Mating Contact Pitch 0.1 inch
Contact Finish Thickness - Mating 10.0μin 0.25μm
Contact Finish Thickness - Post 3.00μin 0.076μm
Material Flammability Rating UL94 V-0
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $2.55000 $2.55

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