HTSW-115-08-G-S

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HTSW-115-08-G-S

Manufacturer part number:HTSW-115-08-G-S

Manufacturer:Samtec Inc.

Description:HTSW Series 1-Row Header Solder Phosphor Bronze Bulk Through Hole Gold Liquid Crystal Polymer (LCP) 15-Position Board to Board or Cable 0.100 2.54mm Height

Case Package:SOT-23

Datasheet:HTSW-115-08-G-S Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
Factory Lead Time	3 Weeks
Contact Material	Phosphor Bronze
Mount	Through Hole
Mounting Type	Through Hole
Contact Shape	Square
Insulation Material	Liquid Crystal Polymer (LCP)
Operating Temperature	-55°C~125°C
Packaging	Bulk
Series	HTSW
Published	2005
JESD-609 Code	e4
Pbfree Code	yes
Part Status	Active
Moisture Sensitivity Level (MSL)	Not Applicable
Termination	Solder
Connector Type	Header
Number of Positions	15
Number of Rows	1
Gender	Male
Additional Feature	E.L.P.
Fastening Type	Push-Pull
Contact Finish - Mating	Gold
MIL Conformance	NO
DIN Conformance	NO
IEC Conformance	NO
Filter Feature	NO
Contact Type	Male Pin
Mixed Contacts	NO
Option	GENERAL PURPOSE
Current Rating (Amps)	Varies by WireGAuge
Insulation Height	0.100 2.54mm
Style	Board to Board or Cable
Number of Positions Loaded	All
Pitch - Mating	0.100 2.54mm
Insulation Color	Natural
Number of Conductors	ONE
Reliability	COMMERCIAL
Contact Length - Post	0.200 5.08mm
Shrouding	Unshrouded
Number Of PCB Rows	1
Lead Pitch	2.54mm
Contact Length - Mating	0.230 5.84mm
PCB Contact Pattern	RECTANGULAR
Mating Information	MULTIPLE MATING PARTS AVAILABLE
Body Breadth	0.098 inch
Overall Contact Length	0.530 13.46mm
Contact Finish Thickness - Mating	10.0μin 0.25μm
Contact Finish Thickness - Post	3.00μin 0.076μm
Material Flammability Rating	UL94 V-0
REACH SVHC	No SVHC
Radiation Hardening	No
RoHS Status	ROHS3 Compliant