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TSM-104-01-SS-SV-P-TR

  • TSM-104-01-SS-SV-P-TR
  • TSM-104-01-SS-SV-P-TR

TSM-104-01-SS-SV-P-TR

TSM-104-01-SS-SV-P-TR

Samtec Inc.

TSM Series 1-Row Header Solder Phosphor Bronze Tape & Reel (TR) Surface Mount Gold Liquid Crystal Polymer (LCP) 4-Position Board to Board or Cable 0.100 2.54mm Height

SOT-23

TSM-104-01-SS-SV-P-TR Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 3 Weeks
Contact Material Phosphor Bronze
Contact Plating Gold
Mounting Type Surface Mount
Contact Shape Square
Insulation Material Liquid Crystal Polymer (LCP)
Operating Temperature -55°C~125°C
Packaging Tape & Reel (TR)
Series TSM
Feature Pick and Place
Part Status Active
Termination Solder
Connector Type Header
Number of Positions 4
Number of Rows 1
Gender Male
Fastening Type Push-Pull
Contact Finish - Mating Gold
Contact Type Male Pin
Pitch 2.54mm
Insulation Height 0.100 2.54mm
Style Board to Board or Cable
Number of Positions Loaded All
Pitch - Mating 0.100 2.54mm
Insulation Color Black
Shrouding Unshrouded
Number of Contacts 4
Contact Finish - Post Tin
Contact Length - Mating 0.230 5.84mm
Contact Finish Thickness - Mating 30.0μin 0.76μm
Material Flammability Rating UL94 V-0
Radiation Hardening No
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
125 $1.23688 $154.61
TSM-104-01-SS-SV-P-TR Product Details

TSM-104-01-SS-SV-P-TR Overview


A Header package is included with it.Its mounting type is Surface Mount.Packaging is performed using a Tape & Reel (TR) case.It is part of the TSM Series of products.A number of features make it more powerful because of its Pick and Place feature.There is no operating temperature for the device.

TSM-104-01-SS-SV-P-TR Features


TSM series


TSM-104-01-SS-SV-P-TR Applications


There are a lot of Samtec Inc.
TSM-104-01-SS-SV-P-TR Rectangular Connectors applications.


  • Embedded systems
  • Datacom
  • Communication
  • Medical technology
  • Military Technology
  • Measuring & Control Technology
  • Instrumentation
  • Automotive Electronics
  • Telecommunications
  • Data Technology

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