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TSM-104-02-F-SV-P-TR

TSM-104-02-F-SV-P-TR

TSM-104-02-F-SV-P-TR

Samtec Inc.

TSM Series 1-Row Header Solder Phosphor Bronze Tape & Reel (TR) Surface Mount Gold Liquid Crystal Polymer (LCP) 4-Position Board to Board or Cable 0.100 2.54mm Height

SOT-23

TSM-104-02-F-SV-P-TR Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 3 Weeks
Contact Material Phosphor Bronze
Mounting Type Surface Mount
Contact Shape Square
Insulation Material Liquid Crystal Polymer (LCP)
Operating Temperature -55°C~125°C
Packaging Tape & Reel (TR)
Series TSM
Feature Pick and Place
Part Status Active
Termination Solder
Connector Type Header
Number of Positions 4
Number of Rows 1
Additional Feature STAGGERED CONFIGURATION
Fastening Type Push-Pull
Contact Finish - Mating Gold
MIL Conformance NO
DIN Conformance NO
IEC Conformance NO
Filter Feature NO
Contact Type Male Pin
Mixed Contacts NO
Option GENERAL PURPOSE
Total Number of Contacts 4
Insulation Height 0.100 2.54mm
Style Board to Board or Cable
Number of Positions Loaded All
Pitch - Mating 0.100 2.54mm
Insulation Color Black
Shrouding Unshrouded
Contact Finish - Post Tin
Contact Length - Mating 0.320 8.13mm
Contact Finish Thickness - Mating 3.00μin 0.076μm
Material Flammability Rating UL94 V-0
RoHS Status ROHS3 Compliant
Lead Free Lead Free
Pricing & Ordering
Quantity Unit Price Ext. Price
125 $0.89320 $111.65
TSM-104-02-F-SV-P-TR Product Details

TSM-104-02-F-SV-P-TR Overview


The product is packaged in Header.This device is mounted in the Surface Mount position.It has been determined that a Tape & Reel (TR) case is necessary to package the product.There is a product in the TSM Series.To name a few, there is also STAGGERED CONFIGURATION.There are a number of advantages to its Pick and Place feature.As a result, the device runs at -55°C~125°C Operating Temperature.

TSM-104-02-F-SV-P-TR Features


TSM series


TSM-104-02-F-SV-P-TR Applications


There are a lot of Samtec Inc.
TSM-104-02-F-SV-P-TR Rectangular Connectors applications.


  • Embedded systems
  • Datacom
  • Communication
  • Medical technology
  • Military Technology
  • Measuring & Control Technology
  • Instrumentation
  • Automotive Electronics
  • Telecommunications
  • Data Technology

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