TSM Series 2-Row Header Solder Phosphor Bronze Tube Surface Mount Gold Liquid Crystal Polymer (LCP) 12-Position Board to Board or Cable 0.100 2.54mm Height
SOT-23
TSM-106-01-L-DV-005 Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
3 Weeks
Contact Material
Phosphor Bronze
Mounting Type
Surface Mount
Contact Shape
Square
Insulation Material
Liquid Crystal Polymer (LCP)
Operating Temperature
-55°C~125°C
Packaging
Tube
Series
TSM
JESD-609 Code
e3
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Termination
Solder
ECCN Code
EAR99
Connector Type
Header
Number of Positions
12
Number of Rows
2
Gender
Male
Additional Feature
POLARIZED
HTS Code
8536.69.40.40
Fastening Type
Push-Pull
Contact Finish - Mating
Gold
MIL Conformance
NO
DIN Conformance
NO
IEC Conformance
NO
Filter Feature
NO
Contact Type
Male Pin
Mixed Contacts
NO
Option
GENERAL PURPOSE
Total Number of Contacts
11
Insulation Height
0.100 2.54mm
Style
Board to Board or Cable
Number of Positions Loaded
11
Pitch - Mating
0.100 2.54mm
Insulation Color
Black
Row Spacing - Mating
0.100 (2.54mm)
Shrouding
Unshrouded
Contact Finish - Post
Tin
Contact Length - Mating
0.230 5.84mm
UL Flammability Code
94V-0
Contact Finish Thickness - Mating
10.0μin 0.25μm
Material Flammability Rating
UL94 V-0
Radiation Hardening
No
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1
$1.65000
$1.65
TSM-106-01-L-DV-005 Product Details
TSM-106-01-L-DV-005 Overview
Currently, it is packaged in Header.The mounting type of the device is Surface Mount.A Tube case is used to package the product.A product of the TSM Series, it belongs to the range of products of that series.Furthermore, there are other features available, such as POLARIZED, to name a few.-55°C~125°C Operating Temperature is the default operating temperature for the device.
TSM-106-01-L-DV-005 Features
TSM series
TSM-106-01-L-DV-005 Applications
There are a lot of Samtec Inc. TSM-106-01-L-DV-005 Rectangular Connectors applications.