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TSM-109-03-L-DV-P-TR

TSM-109-03-L-DV-P-TR

TSM-109-03-L-DV-P-TR

Samtec Inc.

TSM Series 2-Row Header Solder Phosphor Bronze Tape & Reel (TR) Surface Mount Gold Liquid Crystal Polymer (LCP) 18-Position Board to Board or Cable 0.100 2.54mm Height

SOT-23

TSM-109-03-L-DV-P-TR Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Contact Material Phosphor Bronze
Contact Plating Gold
Mounting Type Surface Mount
Contact Shape Square
Insulation Material Liquid Crystal Polymer (LCP)
Operating Temperature -55°C~125°C
Packaging Tape & Reel (TR)
Series TSM
Feature Pick and Place
Part Status Active
Termination Solder
Connector Type Header
Number of Positions 18
Number of Rows 2
Gender Male
Fastening Type Push-Pull
Contact Finish - Mating Gold
Contact Type Male Pin
Pitch 2.54mm
Insulation Height 0.100 2.54mm
Style Board to Board or Cable
Number of Positions Loaded All
Pitch - Mating 0.100 2.54mm
Insulation Color Black
Row Spacing - Mating 0.100 (2.54mm)
Shrouding Unshrouded
Number of Contacts 18
Contact Finish - Post Tin
Contact Length - Mating 0.420 10.67mm
Contact Finish Thickness - Mating 10.0μin 0.25μm
Material Flammability Rating UL94 V-0
Radiation Hardening No
RoHS Status ROHS3 Compliant
Lead Free Lead Free
Pricing & Ordering
Quantity Unit Price Ext. Price
125 $2.04000 $255
TSM-109-03-L-DV-P-TR Product Details

TSM-109-03-L-DV-P-TR Overview


This product is packaged in a Header box.Surface Mount indicates that the device is mounted.An Tape & Reel (TR) case is utilized for packaging the product.The product is a part of the TSM Series.In many ways, Pick and Place makes it more powerful.Operating temperature is set to -55°C~125°C.

TSM-109-03-L-DV-P-TR Features


TSM series


TSM-109-03-L-DV-P-TR Applications


There are a lot of Samtec Inc.
TSM-109-03-L-DV-P-TR Rectangular Connectors applications.


  • Embedded systems
  • Datacom
  • Communication
  • Medical technology
  • Military Technology
  • Measuring & Control Technology
  • Instrumentation
  • Automotive Electronics
  • Telecommunications
  • Data Technology

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