TSM Series 2-Row Header Solder Phosphor Bronze Tape & Reel (TR) Surface Mount Tin Liquid Crystal Polymer (LCP) 20-Position Board to Board or Cable 0.100 2.54mm Height
SOT-23
TSM-110-01-T-DV-LC-P-TR Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
1 Weeks
Contact Material
Phosphor Bronze
Mounting Type
Surface Mount
Contact Shape
Square
Insulation Material
Liquid Crystal Polymer (LCP)
Housing Material
Polymer
Operating Temperature
-55°C~105°C
Packaging
Tape & Reel (TR)
Series
TSM
Published
2015
JESD-609 Code
e3
Feature
Board Lock, Pick and Place
Part Status
Active
Termination
Solder
ECCN Code
EAR99
Connector Type
Header
Number of Positions
20
Number of Rows
2
Gender
Male
HTS Code
8536.69.40.40
Fastening Type
Push-Pull
Contact Finish - Mating
Tin
MIL Conformance
NO
DIN Conformance
NO
IEC Conformance
NO
Filter Feature
NO
Contact Type
Male Pin
Mixed Contacts
NO
Option
GENERAL PURPOSE
Total Number of Contacts
20
Orientation
Straight
Depth
7.36mm
Insulation Height
0.100 2.54mm
Style
Board to Board or Cable
Number of Positions Loaded
All
Pitch - Mating
0.100 2.54mm
Insulation Color
Black
Row Spacing - Mating
0.100 (2.54mm)
Shrouding
Unshrouded
Contact Length - Mating
0.230 5.84mm
UL Flammability Code
94V-0
Max Voltage Rating (AC)
475V
Length
25.4mm
Material Flammability Rating
UL94 V-0
Radiation Hardening
No
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
Pricing & Ordering
Quantity
Unit Price
Ext. Price
125
$2.03912
$254.89
TSM-110-01-T-DV-LC-P-TR Product Details
TSM-110-01-T-DV-LC-P-TR Overview
The product comes in a package of Header.Surface Mount is the type of mounting for the device.To package the product, a Tape & Reel (TR) case is used.The product is a member of the TSM Series.It is more powerful in many ways due to its Board Lock, Pick and Place feature.It operates at an operating temperature of -55°C~105°C.
TSM-110-01-T-DV-LC-P-TR Features
TSM series
TSM-110-01-T-DV-LC-P-TR Applications
There are a lot of Samtec Inc. TSM-110-01-T-DV-LC-P-TR Rectangular Connectors applications.