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SI3066-B-FTR

SI3066-B-FTR

SI3066-B-FTR

Silicon Labs

Telecom device1 Circuits

SOT-23

SI3066-B-FTR Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 8 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Operating Temperature0°C~70°C
PackagingTape & Reel (TR)
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Function Direct Access Arrangement (DAA)
Number of Circuits 1
RoHS StatusRoHS Compliant
In-Stock:3056 items

SI3066-B-FTR Product Details

SI3066-B-FTR Overview


A Tape & Reel (TR)-packing method is used to pack telecommunications equipment.A Surface Mount-mount is used for mounting the telecom circuit.1 circuits are used in this telecom IC .A 0°C~70°C-temperature setting offers reliable performance.Mounted in the direction of Surface Mount.

SI3066-B-FTR Features



SI3066-B-FTR Applications


There are a lot of Silicon Labs SI3066-B-FTR Telecom applications.

  • Digital subscriber line access multiplexer (DSLAM)
  • Switching Systems
  • Cable Telephony
  • Digital loop carrier (DLC)
  • LAN Routers
  • Digital Cross-connect Systems (DCS)
  • Inverse Multiplexing for ATM (IMA) Wireless Base Stations
  • E1 Multiplexer
  • T1/E1/J1 Performance Monitoring
  • Fractional T1/E1/J1

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