SI32266-C-FM1R Overview

The QFN package reduces the amount of space on a board.Telecommunications equipment is packed in the Tape & Reel (TR)-way.The mounting type is Surface Mount.Telecom circuit is made up of 1 circuits.Providing 3.3V wtelecom IC's efficiencyh the correct supply voltage will improve efficiency.Surface Mount is the way telecom switching is mounted.It adopts DIGITAL SLIC as its telecom IC type.The ProSLIC? series is capable of providing a number of similar functions to the W series.

SI32266-C-FM1R Features

Available in the QFN package
DIGITAL SLIC as telecom IC type

SI32266-C-FM1R Applications

There are a lot of Silicon Labs SI32266-C-FM1R Telecom applications.

• Digital access cross connects
• T1 Digital Cross Connects (DSX-1)
• E1 Multiplexer
• Integrated Access Devices (IADs)
• T1/E1/J1 add/drop multiplexers (MUX)
• Public switching systems
• E2 Rates PCM Line Interface
• Multichannel DS1 Test Equipment
• Digital loop carrier (DLC)
• T1/E1/J1 LAN/WAN Routers