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STP11NM60ND

STP11NM60ND

STP11NM60ND

STMicroelectronics

STP11NM60ND datasheet pdf and Transistors - FETs, MOSFETs - Single product details from STMicroelectronics stock available on our website

SOT-23

STP11NM60ND Datasheet

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Specifications
Name Value
Type Parameter
Factory Lead Time 16 Weeks
Lifecycle Status ACTIVE (Last Updated: 8 months ago)
Contact Plating Tin
Mount Through Hole
Mounting Type Through Hole
Package / Case TO-220-3
Number of Pins 3
Transistor Element Material SILICON
Operating Temperature 150°C TJ
Packaging Tube
Series FDmesh™ II
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 3
ECCN Code EAR99
Resistance 450mOhm
Subcategory FET General Purpose Power
Technology MOSFET (Metal Oxide)
Base Part Number STP11N
Pin Count 3
Number of Elements 1
Power Dissipation-Max 90W Tc
Element Configuration Single
Operating Mode ENHANCEMENT MODE
Power Dissipation 90W
Turn On Delay Time 16 ns
FET Type N-Channel
Transistor Application SWITCHING
Rds On (Max) @ Id, Vgs 450m Ω @ 5A, 10V
Vgs(th) (Max) @ Id 5V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds 850pF @ 50V
Current - Continuous Drain (Id) @ 25°C 10A Tc
Gate Charge (Qg) (Max) @ Vgs 30nC @ 10V
Rise Time 7ns
Drive Voltage (Max Rds On,Min Rds On) 10V
Vgs (Max) ±25V
Fall Time (Typ) 9 ns
Turn-Off Delay Time 50 ns
Continuous Drain Current (ID) 10A
Threshold Voltage 4V
JEDEC-95 Code TO-220AB
Gate to Source Voltage (Vgs) 25V
Drain to Source Breakdown Voltage 600V
Pulsed Drain Current-Max (IDM) 40A
Avalanche Energy Rating (Eas) 200 mJ
Height 15.75mm
Length 10.4mm
Width 4.6mm
Radiation Hardening No
REACH SVHC No SVHC
RoHS Status ROHS3 Compliant
Lead Free Lead Free
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $3.88000 $3.88
50 $3.11860 $155.93
100 $2.84130 $284.13
500 $2.30076 $1150.38
1,000 $1.94040 $1.9404
2,500 $1.84338 $3.68676
5,000 $1.77408 $8.8704
STP11NM60ND Product Details
STP11NM60ND Description


STP11NM60ND, in a family of superjunction FDmesh Ⅱ, is a 600V N-channel MOSFET transistor. The new FDmesh superjunction architecture incorporates a vertical structure within a conventional strip MOSFET structure, while also incorporating a faster and more reliable intrinsic body diode. In addition to reducing on-resistance and recovery time, these technical improvements can further improve switching efficiency and reduce drive losses by reducing gate capacitance, gate charge, and gate input resistance. Improved reliability during switching, especially in bridge topologies, including zero-voltage switching (ZVS) structures at low loads, enables new products with high dv/dt values.


STP11NM60ND Features


Fast switching
Very low on-resistance
100% avalanche tested
Higher thermal management efficiency
More package options and current performance


STP11NM60ND Applications


Switching applications
Bridge topologies
ZVS phase-shift converters

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