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TXR40AB00-1606AI

  • TXR40AB00-1606AI
  • TXR40AB00-1606AI

TXR40AB00-1606AI

TXR40AB00-1606AI

TE Connectivity Aerospace, Defense and Marine

TXR40AB00-1606AI datasheet pdf and Circular Connectors - Backshells and Cable Clamps product details from TE Connectivity Aerospace, Defense and Marine stock available on our website

SOT-23

TXR40AB00-1606AI Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 14 Weeks
Lifecycle Status ACTIVE (Last Updated: 4 days ago)
Package / Case Aluminum
Material Aluminum Alloy
Body Material Aluminium
Published 2005
Series TXR
Feature Tinel Lock
Part Status Active
Moisture Sensitivity Level (MSL) Not Applicable
Type Backshell, Heat Shrink Adapter
Max Operating Temperature 175°C
Min Operating Temperature -65°C
Color Olive Drab
Contact Finish - Mating NOT SPECIFIED
Shielding Shielded
Ingress Protection Environment Resistant
Reach Compliance Code not_compliant
Military Standard MIL-DTL-38999
Shell Size - Insert 17 E
ELV Non-Compliant
Plating Cadmium
Thread Size M25x1
Wire/Cable Diameter 7.6 mm
Includes 4 pcs - 1 Backshell, 1 Braid, 1 O-Ring, 1 Tinel Ring
Cable Exit 180°
Diameter - Outside 1.279 (32.49mm)
RoHS Status Non-RoHS Compliant
Lead Free Not Applicable
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $57.09000 $57.09
10 $53.72800 $537.28
25 $52.04920 $1301.23
50 $48.69100 $2434.55
100 $46.00460 $4600.46
TXR40AB00-1606AI Product Details

TXR40AB00-1606AI Overview


This is from the TXR Series.It is best used at temperatures below 175°C.Temperatures below -65°C are required for this device.Located in the packaging with the Aluminum is a device.A number of advantages can be derived from its Tinel Lock feature.With this part, you get a lot of benefits that you won't find in other Backshell, Heat Shrink Adapter products.

TXR40AB00-1606AI Features


TXR series

TXR40AB00-1606AI Applications


There are a lot of TE Connectivity Aerospace, Defense and Marine TXR40AB00-1606AI Circular Connectors applications.

  • Automotive Electronics
  • Embedded systems
  • Anywhere power is distributed
  • Refrigeration control
  • Variable speed/frequency drivers
  • Communication
  • Data Technology
  • Blowers
  • Instrumentation
  • Datacom

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