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1-1776267-7

1-1776267-7

1-1776267-7

TE Connectivity AMP Connectors

0.197 5.00mm Green Bulk Polyamide (PA66), Nylon 6/6 Through Hole Vertical with Board Screw - Leaf Spring, Wire Guard 1 Levels 14-22 AWG Buchanan

SOT-23

1-1776267-7 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Contact Plating Brass, Copper, Tin
Mount Through Hole
Mounting Type Through Hole
Housing Material Polyamide (PA66), Nylon 6/6
Contact Material - Plating Brass - Copper Tin Plated
Clamp Material - Plating Steel, Stainless
Screw Material - Plating Steel, Galvanized - Chromate Plated
Operating Temperature -55°C~105°C
Packaging Bulk
Series Buchanan
Published 2016
Feature Interlocking (Side)
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Screw
ECCN Code EAR99
Color Green
Additional Feature POLYAMIDE, LOW PROFILE, UL 94V-0
HTS Code 8536.69.40.40
Pitch 0.197 5.00mm
Wire Gauge 14-22 AWG
Voltage 300V
Plating Chromate, Galvanized, Steel
Number of Levels 1
Current 10A
Wire Gauge (Max) 22 AWG
Wire Gauge (Min) 14 AWG
Terminal and Terminal Block Type STRIP TERMINAL BLOCK
Torque - Screw 0.51 Nm (4.5 Lb-In)
Positions Per Level 17
Number of Ways 17
Mating Orientation Vertical with Board
Wire Termination Screw - Leaf Spring, Wire Guard
Screw Thread M2.6
Wire Cross Section 2 mm2
RoHS Status RoHS Compliant
1-1776267-7 Product Details

1-1776267-7 Overview


There is a mounting type of Through Hole for this device.It is necessary to use a Bulk case for packaging the product.This product is part of the Buchanan Series.Moreover, there are a number of other features, including POLYAMIDE, LOW PROFILE, UL 94V-0, to name just a few.In many ways, its Interlocking (Side) feature makes it more powerful.Through Hole is used to mount the part.In this case, the device operates at -55°C~105°C Operating Temperature.

1-1776267-7 Features


Buchanan series


1-1776267-7 Applications


There are a lot of TE Connectivity AMP Connectors
1-1776267-7 Terminal Blocks applications.


  • Transportation
  • Embedded systems
  • Datacom
  • Communication
  • Medical technology
  • Military Technology
  • Measuring & Control Technology
  • Instrumentation
  • Automotive Electronics
  • Telecommunications

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