2013012-3

new-10%

Manufacturer part number:2013012-3

Manufacturer:TE Connectivity AMP Connectors

Description:Conn Board to Board RCP 50 POS 0.6mm Solder ST SMD Tray

Case Package:SOT-23

Datasheet:2013012-3 Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
Factory Lead Time	16 Weeks
Lifecycle Status	ACTIVE (Last Updated: 5 days ago)
Contact Plating	Gold
Mounting Type	Surface Mount
Housing Material	Thermoplastic
PCB Mounting Orientation	Vertical
PCB Mount Retention	With
PCB Mount Alignment	With
Packaging	Tray
Published	2007
Series	Free Height (FH)
Feature	Board Guide, Solder Retention
Part Status	Active
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Termination	SMD/SMT
Connector Type	Receptacle, Center Strip Contacts
Number of Positions	50
Max Operating Temperature	85°C
Min Operating Temperature	-40°C
Number of Rows	2
Gender	Female
Pitch	0.024 0.60mm
Orientation	Vertical
Contact Finish	Gold
Number of Contacts	50
Housing Color	Black, Natural
Operating Supply Voltage	50V
Insulation Resistance	500MOhm
Row Spacing	3.593592 mm
Plating	Gold
Contact Current Rating	500mA
Circuit Application	Signal
Mating Alignment	With
Preloaded	Yes
Stackable	Yes
Height	3.25mm
Contact Finish Thickness	30.0μin 0.76μm
Contact Finish Thickness - Mating	760 nm
Height Above Board	0.128 3.25mm
Stack Height (Mating)	4mm
PCB Thickness	19.304mm
Stack Height	3.9878mm
Radiation Hardening	No
RoHS Status	Non-RoHS Compliant
Flammability Rating	UL94 V-0