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533094-3

533094-3

533094-3

TE Connectivity AMP Connectors

533094-3 datasheet pdf and Backplane Connectors - Specialized product details from TE Connectivity AMP Connectors stock available on our website

SOT-23

533094-3 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 15 Weeks
Lifecycle Status ACTIVE (Last Updated: 1 day ago)
Contact Material Bronze
Contact Plating Tin, Gold
Mount Through Hole
Mounting Type Through Hole
Contact Shape Square
Housing Material Thermoplastic
Underplate Material Nickel
PCB Mount Alignment Without
Operating Temperature -65°C~125°C
Packaging Tube
Published 1998
Series HDI (High Density Interconnect)
Feature Mating Guide
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Press-Fit
Connector Type Header, Male Pins
Number of Positions 423
Color Natural
Number of Rows 3
Gender Male
MIL Conformance NO
DIN Conformance NO
IEC Conformance NO
Filter Feature NO
Mixed Contacts NO
Option GENERAL PURPOSE
Pitch 0.100 2.54mm
Total Number of Contacts 423
Orientation Vertical
Number of Positions Loaded All
Contact Finish Gold
Lead Pitch 2.54mm
Housing Color Brown, Natural
Lead Length 6.35mm
Insulation Resistance 3MOhm
Row Spacing 2.54 mm
ELV Non-Compliant
Connector Style High Density (HDC, HDI, HPC)
Contact Current Rating 3A
Circuit Application Signal
Mating Post Length 5.33mm
Mating Alignment With
Stackable No
Height 11.684mm
Length 392.43mm
Contact Finish Thickness 30.0μin 0.76μm
Contact Finish Thickness - Mating 760 nm
Length - Tail 6.35mm
PCB Thickness 2.36mm
Material Flammability Rating UL94 V-0
RoHS Status Non-RoHS Compliant
Flammability Rating UL94 V-0
Lead Free Not Applicable
Pricing & Ordering
Quantity Unit Price Ext. Price
120 $63.79117 $7654.9404
533094-3 Product Details

533094-3 Overview


Packaging is in the form of Header, Male Pins.This device has a Through Hole mounting type.Packaging is performed using a Tube case.Product number HDI (High Density Interconnect) belongs to the HDI (High Density Interconnect) Series.Many aspects of its Mating Guide feature increase its effectiveness.It is mounted by Through Hole.Running in -65°C~125°C Operating Temperature.

533094-3 Features


HDI (High Density Interconnect) series

533094-3 Applications


There are a lot of TE Connectivity AMP Connectors 533094-3 Backplane Connectors applications.

  • Embedded systems
  • Control panels
  • LED municipal outdoor and street lighting
  • Measuring & Control Technology
  • All Electrical Machinery
  • Medical technology
  • Electrical substations
  • Instrumentation
  • Transportation
  • Variable speed/frequency drivers

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