5532903-3 datasheet pdf and Backplane Connectors - Specialized product details from TE Connectivity AMP Connectors stock available on our website
SOT-23
5532903-3 Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
20 Weeks
Lifecycle Status
ACTIVE (Last Updated: 3 days ago)
Contact Plating
Tin, Gold
Mount
Through Hole
Mounting Type
Through Hole, Right Angle
Housing Material
Thermoplastic
PCB Mounting Orientation
Right Angle
Underplate Material
Nickel
PCB Mount Alignment
Without
Operating Temperature
-65°C~125°C
Packaging
Tube
Published
1998
Series
HDI (High Density Interconnect)
Feature
Mating Guide
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Termination
Solder
Connector Type
Receptacle, Female Sockets
Number of Positions
128
Color
Brown
Number of Rows
4
Gender
Receptacle
Pitch
0.100 2.54mm
Orientation
Right Angle
Number of Positions Loaded
All
Contact Finish
Gold
Lead Length
3.048mm
Insulation Resistance
4MOhm
ELV
Compliant
Connector Style
High Density (HDC, HDI, HPC)
Contact Current Rating
3A
Circuit Application
Signal
Mating Alignment
With
Stackable
No
Height
11.02mm
Length
100.33mm
Contact Finish Thickness
30.0μin 0.76μm
Contact Finish Thickness - Mating
760 nm
Length - Tail
3.05mm
PCB Thickness
2.36mm
Material Flammability Rating
UL94 V-0
RoHS Status
RoHS Compliant
Flammability Rating
UL94 V-0
Pricing & Ordering
Quantity
Unit Price
Ext. Price
280
$35.57550
$9961.14
5532903-3 Product Details
5532903-3 Overview
Packaging is in the form of Receptacle, Female Sockets.It's mounted Through Hole, Right Angle.To package the product, we use a Tube case.The product is part of the HDI (High Density Interconnect) Series.Its Mating Guide feature renders it more powerful in many ways.This part is mounted by Through Hole. The device is operating at -65°C~125°C Operating Temperature.
5532903-3 Features
HDI (High Density Interconnect) series
5532903-3 Applications
There are a lot of TE Connectivity AMP Connectors 5532903-3 Backplane Connectors applications.