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5533444-3

5533444-3

5533444-3

TE Connectivity AMP Connectors

5533444-3 datasheet pdf and Backplane Connectors - Specialized product details from TE Connectivity AMP Connectors stock available on our website

SOT-23

5533444-3 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 20 Weeks
Lifecycle Status ACTIVE (Last Updated: 5 months ago)
Contact Plating Tin, Gold
Mount Through Hole
Mounting Type Through Hole, Right Angle
Contact Shape Square
Housing Material Thermoplastic
PCB Mounting Orientation Right Angle
Underplate Material Nickel
PCB Mount Alignment With
Operating Temperature -65°C~125°C
Packaging Tube
Published 1998
Series HDI (High Density Interconnect)
Feature Mating Guide
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Connector Type Header, Male Pins
Number of Positions 128
Number of Rows 4
Gender Male
MIL Conformance NO
DIN Conformance NO
IEC Conformance NO
Option GENERAL PURPOSE
Pitch 0.100 2.54mm
Orientation Right Angle
Number of Positions Loaded All
Contact Finish Gold
Housing Color Brown, Black
Lead Length 4.572mm
Insulation Resistance 4MOhm
Row Spacing 2.54 mm
ELV Compliant
Connector Style High Density (HDC, HDI, HPC)
Contact Current Rating 2.25A
Circuit Application Signal
Mating Post Length 5.334mm
Mating Alignment Without
Stackable No
Height 14.73mm
Length 100.33mm
Contact Finish Thickness 30.0μin 0.76μm
Plating Thickness 5.08μm
Contact Finish Thickness - Mating 760 nm
Length - Tail 4.57mm
PCB Thickness 1.52mm
Material Flammability Rating UL94 V-0
RoHS Status RoHS Compliant
Flammability Rating UL94 V-0
Pricing & Ordering
Quantity Unit Price Ext. Price
1,050 $14.12477 $14.12477
5533444-3 Product Details

5533444-3 Overview


Currently, it is packaged in Header, Male Pins.Mounting type Through Hole, Right Angle is selected for the device.It has been determined that a Tube case is necessary to package the product.It is part of the HDI (High Density Interconnect) Series of products.A number of features make it more powerful because of its Mating Guide feature.Through Hole is used to mount the part.Device runs at -65°C~125°C Operating Temperature.

5533444-3 Features


HDI (High Density Interconnect) series

5533444-3 Applications


There are a lot of TE Connectivity AMP Connectors 5533444-3 Backplane Connectors applications.

  • Embedded systems
  • Electrical substations
  • Automotive Electronics
  • Data Technology
  • Medical technology
  • Instrumentation
  • Anywhere power is distributed
  • Industrial Automation
  • Control panels
  • Blowers

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