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PC745BMGH350LE

PC745BMGH350LE

PC745BMGH350LE

Teledyne Technologies

Microprocessor

SOT-23

PC745BMGH350LE Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
ECCN (US) 3A001.a.2.c
HTS 8542.31.00.01
Instruction Set Architecture RISC
Number of CPU Cores 1
Data Bus Width (bit) 32
Instruction Cache Size 32KB
Maximum Speed (MHz) 350
UART 0
USART 0
Data Cache Size 32KB
Multiply Accumulate No
I2C 0
I2S 0
Minimum Operating Supply Voltage (V) 1.8
Typical Operating Supply Voltage (V) 2
Maximum Operating Supply Voltage (V) 2.1
I/O Voltage (V) 2.5|3.3
Minimum Operating Temperature (°C) -55
Maximum Operating Temperature (°C) 125
Supplier Temperature Grade Military
Standard Package Name BGA
Supplier Package HITCE CBGA
Mounting Surface Mount
Package Height 2.08(Max)
Package Length 21
Package Width 21
PCB changed 255
Part Status Active
Pin Count 255
Ethernet 0
USB 0
SPI 0
Device Core PowerPC
RoHS Status RoHS non-compliant
PC745BMGH350LE Product Details

PC745BMGH350LE Overview


Embedded microprocessor bodies are injected with 255 pins.

PC745BMGH350LE Features




PC745BMGH350LE Applications


There are a lot of Teledyne Technologies
PC745BMGH350LE Microprocessor applications.


  • Consumer electronics products
  • Toys
  • Robots
  • Radio
  • Television
  • Heater/Fan
  • Calculator
  • Kindle
  • Christmas lights
  • 3D printers

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