CSD25301W1015 datasheet pdf and Transistors - FETs, MOSFETs - Single product details from Texas Instruments stock available on our website
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CSD25301W1015 Datasheet
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Specifications
Name
Value
Type
Parameter
Contact Plating
Copper, Silver, Tin
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
6-UFBGA, DSBGA
Number of Pins
6
Transistor Element Material
SILICON
Operating Temperature
-55°C~150°C TJ
Packaging
Tape & Reel (TR)
Series
NexFET™
JESD-609 Code
e1
Pbfree Code
no
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
6
Termination
SMD/SMT
ECCN Code
EAR99
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Subcategory
Other Transistors
Technology
MOSFET (Metal Oxide)
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
260
Base Part Number
CSD25301
Pin Count
6
Number of Elements
1
Configuration
SINGLE WITH BUILT-IN DIODE
Power Dissipation-Max
1.5W Ta
Operating Mode
ENHANCEMENT MODE
Power Dissipation
1.5W
Turn On Delay Time
4 ns
FET Type
P-Channel
Transistor Application
SWITCHING
Rds On (Max) @ Id, Vgs
75m Ω @ 1A, 4.5V
Vgs(th) (Max) @ Id
1V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds
270pF @ 10V
Current - Continuous Drain (Id) @ 25°C
2.2A Tc
Gate Charge (Qg) (Max) @ Vgs
2.5nC @ 4.5V
Rise Time
2ns
Drive Voltage (Max Rds On,Min Rds On)
1.5V 4.5V
Vgs (Max)
±8V
Fall Time (Typ)
12 ns
Turn-Off Delay Time
29 ns
Continuous Drain Current (ID)
2.2A
Gate to Source Voltage (Vgs)
8V
Drain-source On Resistance-Max
0.22Ohm
Drain to Source Breakdown Voltage
20V
Dual Supply Voltage
20V
Nominal Vgs
750 mV
Feedback Cap-Max (Crss)
40 pF
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Contains Lead
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1
$4.211630
$4.21163
10
$3.973235
$39.73235
100
$3.748335
$374.8335
500
$3.536166
$1768.083
1000
$3.336005
$3336.005
CSD25301W1015 Product Details
CSD25301W1015 Description
The device's design aims to produce the lowest gate charge and on resistance while maintaining outstanding thermal properties in an extremely low profile. These devices are made to offer a high level of dv/dt capability for the most demanding applications in addition to a significant reduction in on-resistance.