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TC74AC126FN-ELP

TC74AC126FN-ELP

TC74AC126FN-ELP

Toshiba

5V Clock Buffer DUAL 14 Pins

SOT-23

TC74AC126FN-ELP Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mount Surface Mount
Number of Pins 14
Packaging Tape and Reel
Pbfree Code no
Number of Terminations 14
Max Operating Temperature 85°C
Min Operating Temperature -40°C
Additional Feature 50 OHM LINE DRIVE CAPABILITY FOR < = 10MS ONE O/P AT A TIME
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 240
Number of Functions 4
Supply Voltage 5V
Pin Count 14
Polarity Non-Inverting
Temperature Grade INDUSTRIAL
Max Supply Voltage 5.5V
Min Supply Voltage 2V
Load Capacitance 50pF
Number of Ports 2
Number of Bits 1
Propagation Delay 14 ns
Quiescent Current 8μA
Family AC
Logic Function Buffer
Number of Inputs 4
Output Characteristics 3-STATE
Logic IC Type BUS DRIVER
High Level Output Current -24mA
Low Level Output Current 24mA
Radiation Hardening No
RoHS Status RoHS Compliant
TC74AC126FN-ELP Product Details

TC74AC126FN-ELP Overview


It is available in the case Tape and Reel. There are 14 terminations in it. Using a supply voltage of 5V allows for high efficiency. It's in the way of Surface Mount. It has a number of pins of 14. The 14 pins are utilized for operation. At a minimum working temperature of -40°C, it maintains reliable operation. When the maximum operating temperature is set to 85°C, stable operation is ensured. It is part of the AC family of electronic buffer ICs. A logic IC with a value of BUS DRIVER is used for this application. There is a maximum supply voltage of 5.5VV that can be handled by this clock divider. As low as possible, the voltage source of the clock divider can be 2V. It is also possible to obtain 50 OHM LINE DRIVE CAPABILITY FOR

TC74AC126FN-ELP Features


14 terminations
logic IC type of BUS DRIVER


TC74AC126FN-ELP Applications


There are a lot of Toshiba
TC74AC126FN-ELP Clock Buffers & Drivers applications.


  • High performance communication system
  • Data center
  • Cloud computing
  • Network
  • High speed industry
  • High-end consumer electronics
  • Data communication
  • Telecommunications
  • Computing
  • Medical imaging

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