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TE0803-01-03CG-1EA

TE0803-01-03CG-1EA

TE0803-01-03CG-1EA

Trenz Electronic GmbH

MPU Core Zynq UltraScale+ XCZU3CG-1SFVC784E 2.99 x 2.05 76mmx52mm 0°C~85°C 128MB B2B TE0803 2GB

SOT-23

TE0803-01-03CG-1EA Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Operating Temperature 0°C~85°C
Series TE0803
Size / Dimension 2.99 x 2.05 76mmx52mm
Part Status Discontinued
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Connector Type B2B
RAM Size 2GB
Core Processor Zynq UltraScale+ XCZU3CG-1SFVC784E
Module/Board Type MPU Core
Flash Size 128MB
RoHS Status ROHS3 Compliant
TE0803-01-03CG-1EA Product Details

TE0803-01-03CG-1EA Overview


The module or board type of the microcontroller is MPU Core.Microprocessor chip is driven by a processor with Zynq UltraScale+ XCZU3CG-1SFVC784E cores.0°C~85°C is the default setting for the microcontroller.The MCU electronics's size of flash is 128MB.B2B is the connector type.MCU chip belongs to the TE0803 Series.To ensure that the software runs normally, the RAM size is reduced to 2GB.

TE0803-01-03CG-1EA Features


Core processor of Zynq UltraScale+ XCZU3CG-1SFVC784E
Flash size of 128MB


TE0803-01-03CG-1EA Applications


There are a lot of Trenz Electronic GmbH
TE0803-01-03CG-1EA Microcontroller, Microprocessor, FPGA Modules applications.


  • Industrial Automation
  • Industrial Instrumentation
  • Embedded Control Processing
  • Embedded User Interfaces
  • Test and Measurement
  • Medical Devices
  • Data Acquisition
  • Industrial Control
  • Process Control
  • Process Monitoring

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