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TE0803-02-04CG-1EB

TE0803-02-04CG-1EB

TE0803-02-04CG-1EB

Trenz Electronic GmbH

MPU Core Zynq UltraScale+ XCZU4CG-1SFVC784E 2.05 x 2.99 52mmx76mm 0°C~85°C 256MB B2B TE0803 2GB

SOT-23

TE0803-02-04CG-1EB Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 12 Weeks
Operating Temperature 0°C~85°C
Series TE0803
Size / Dimension 2.05 x 2.99 52mmx76mm
Part Status Active
Moisture Sensitivity Level (MSL) Not Applicable
Connector Type B2B
RAM Size 2GB
Core Processor Zynq UltraScale+ XCZU4CG-1SFVC784E
Module/Board Type MPU Core
Flash Size 256MB
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $703.80000 $703.8
TE0803-02-04CG-1EB Product Details

TE0803-02-04CG-1EB Overview


This microcontroller has a module or board type of MPU Core, which indicates that it is a module.There are Zynq UltraScale+ XCZU4CG-1SFVC784E cores in its processor, which is what powers the microcontroller.It is not surprising that 0°C~85°C is the microcontroller's default setting.This MCU electronics has a size of 256MB in terms of its flash.There are two types of connectors. The first is B2B.I would say that MCU chip belongs to the TE0803 Series.As a result, the RAM size of the software has been reduced to 2GB in order to ensure that MCU chip runs normally.

TE0803-02-04CG-1EB Features


Core processor of Zynq UltraScale+ XCZU4CG-1SFVC784E
Flash size of 256MB


TE0803-02-04CG-1EB Applications


There are a lot of Trenz Electronic GmbH
TE0803-02-04CG-1EB Microcontroller, Microprocessor, FPGA Modules applications.


  • Process Control
  • Process Monitoring
  • Healthcare Monitoring
  • Patient Monitoring
  • IoT Secure Gateways
  • Human Machine Interface
  • Human Machine Control Panel
  • Home and Building Automation
  • Thermostat
  • Industrial Gateways

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