TE0803-03-3AE11-A datasheet pdf and Embedded - Microcontroller, Microprocessor, FPGA Modules product details from Trenz Electronic GmbH stock available on our website
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TE0803-03-3AE11-A Datasheet
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Specifications
Name
Value
Type
Parameter
Factory Lead Time
12 Weeks
Operating Temperature
0°C~85°C
Series
TE0803
Size / Dimension
2.05 x 2.99 52mmx76mm
Part Status
Active
Moisture Sensitivity Level (MSL)
Not Applicable
Connector Type
B2B
RAM Size
2GB
Core Processor
Zynq UltraScale+ XCZU2CG-1SFVC784E
Module/Board Type
MPU Core
Flash Size
128MB
TE0803-03-3AE11-A Product Details
TE0803-03-3AE11-A Overview
A MPU Core-type board or module is used in this microcontroller.There are Zynq UltraScale+ XCZU2CG-1SFVC784E cores in its processor, which is what powers the microcontroller.0°C~85°C is the default setting for the microcontroller.Flash size on this MCU electronics is 128MB.Connector type B2B refers to the type of connector.I would say that MCU chip belongs to the TE0803 Series.As a precaution for ensuring that the software runs normally, the RAM size of the computer has been reduced to 2GB.
TE0803-03-3AE11-A Features
Core processor of Zynq UltraScale+ XCZU2CG-1SFVC784E Flash size of 128MB
TE0803-03-3AE11-A Applications
There are a lot of Trenz Electronic GmbH TE0803-03-3AE11-A Microcontroller, Microprocessor, FPGA Modules applications.