TE0803-03-4BE11-A datasheet pdf and Embedded - Microcontroller, Microprocessor, FPGA Modules product details from Trenz Electronic GmbH stock available on our website
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TE0803-03-4BE11-A Datasheet
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Specifications
Name
Value
Type
Parameter
Factory Lead Time
12 Weeks
Operating Temperature
0°C~85°C
Series
TE0803
Size / Dimension
2.05 x 2.99 52mmx76mm
Part Status
Active
Moisture Sensitivity Level (MSL)
Not Applicable
Connector Type
B2B
RAM Size
2GB
Core Processor
Zynq UltraScale+ XCZU4EG-1SFVC784E
Module/Board Type
MPU Core
Flash Size
128MB
TE0803-03-4BE11-A Product Details
TE0803-03-4BE11-A Overview
Microcontroller MPU Core is a module or board.It has Zynq UltraScale+ XCZU4EG-1SFVC784E cores and is driven by a processor.The default setting of the microcontroller is 0°C~85°C.MCU chips flash size is 128MB.In this case, the connector type is B2B.The TE0803 Series is the group in which MCU chip belongs.The RAM size has been reduced to 2GB in order to ensure that the software runs normally.
TE0803-03-4BE11-A Features
Core processor of Zynq UltraScale+ XCZU4EG-1SFVC784E Flash size of 128MB
TE0803-03-4BE11-A Applications
There are a lot of Trenz Electronic GmbH TE0803-03-4BE11-A Microcontroller, Microprocessor, FPGA Modules applications.