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TE0803-03-4BE11-A

TE0803-03-4BE11-A

TE0803-03-4BE11-A

Trenz Electronic GmbH

TE0803-03-4BE11-A datasheet pdf and Embedded - Microcontroller, Microprocessor, FPGA Modules product details from Trenz Electronic GmbH stock available on our website

SOT-23

TE0803-03-4BE11-A Datasheet

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Specifications
Name Value
Type Parameter
Factory Lead Time 12 Weeks
Operating Temperature 0°C~85°C
Series TE0803
Size / Dimension 2.05 x 2.99 52mmx76mm
Part Status Active
Moisture Sensitivity Level (MSL) Not Applicable
Connector Type B2B
RAM Size 2GB
Core Processor Zynq UltraScale+ XCZU4EG-1SFVC784E
Module/Board Type MPU Core
Flash Size 128MB
TE0803-03-4BE11-A Product Details

TE0803-03-4BE11-A Overview


Microcontroller MPU Core is a module or board.It has Zynq UltraScale+ XCZU4EG-1SFVC784E cores and is driven by a processor.The default setting of the microcontroller is 0°C~85°C.MCU chips flash size is 128MB.In this case, the connector type is B2B.The TE0803 Series is the group in which MCU chip belongs.The RAM size has been reduced to 2GB in order to ensure that the software runs normally.

TE0803-03-4BE11-A Features


Core processor of Zynq UltraScale+ XCZU4EG-1SFVC784E
Flash size of 128MB

TE0803-03-4BE11-A Applications


There are a lot of Trenz Electronic GmbH TE0803-03-4BE11-A Microcontroller, Microprocessor, FPGA Modules applications.

  • Process Control
  • Home and Building Automation
  • Embedded Instrumentation
  • Closed Loop Motor Control
  • Medical Instrumentation
  • Portable Data Terminals
  • Embedded User Interfaces
  • Test and Measurement
  • Industrial Instrumentation
  • Medical Devices

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