TE0808-04-06EG-1E3 datasheet pdf and Embedded - Microcontroller, Microprocessor, FPGA Modules product details from Trenz Electronic GmbH stock available on our website
SOT-23
TE0808-04-06EG-1E3 Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Operating Temperature
0°C~85°C
Series
TE0808
Size / Dimension
2.05 x 2.99 52mmx76mm
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Connector Type
B2B
RAM Size
4GB
Core Processor
Zynq UltraScale+ XCZU6EG-1FFVC900E
Module/Board Type
MPU Core
Flash Size
128MB
RoHS Status
ROHS3 Compliant
TE0808-04-06EG-1E3 Product Details
TE0808-04-06EG-1E3 Overview
In this case, the module or board type of the microcontroller is MPU Core.Processors with Zynq UltraScale+ XCZU6EG-1FFVC900E cores drive it.Microcontrollers are configured by default to 0°C~85°C.The size of the flash on the MCU electronics is 128MB.B2B' stands for connector type.A member of the TE0808 Series, MCU chip has an LCD screen.Software runs normally with RAM size 4GB when the RAM size is reduced.
TE0808-04-06EG-1E3 Features
Core processor of Zynq UltraScale+ XCZU6EG-1FFVC900E Flash size of 128MB
TE0808-04-06EG-1E3 Applications
There are a lot of Trenz Electronic GmbH TE0808-04-06EG-1E3 Microcontroller, Microprocessor, FPGA Modules applications.