TE0808-04-06EG-1EK datasheet pdf and Embedded - Microcontroller, Microprocessor, FPGA Modules product details from Trenz Electronic GmbH stock available on our website
SOT-23
TE0808-04-06EG-1EK Datasheet
non-compliant
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Specifications
Name
Value
Type
Parameter
Operating Temperature
0°C~85°C
Series
TE0808
Size / Dimension
2.05 x 2.99 52mmx76mm
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Connector Type
B2B
RAM Size
4GB
Core Processor
Zynq UltraScale+ XCZU6EG-1FFVC900E
Module/Board Type
MPU Core
Flash Size
128MB
RoHS Status
ROHS3 Compliant
TE0808-04-06EG-1EK Product Details
TE0808-04-06EG-1EK Overview
The module or board type of the microcontroller is MPU Core.Microprocessor chip is powered by a processor with a total of Zynq UltraScale+ XCZU6EG-1FFVC900E cores in it.The microcontroller is set to 0°C~85°C by default, which is the default setting.Flash size on this MCU electronics is 128MB.The connector type B2B refers to the connector type.TE0808-Series.As a precaution for ensuring that the software runs normally, the RAM size of the computer has been reduced to 4GB.
TE0808-04-06EG-1EK Features
Core processor of Zynq UltraScale+ XCZU6EG-1FFVC900E Flash size of 128MB
TE0808-04-06EG-1EK Applications
There are a lot of Trenz Electronic GmbH TE0808-04-06EG-1EK Microcontroller, Microprocessor, FPGA Modules applications.