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SI9707DY-T1-E3

SI9707DY-T1-E3

SI9707DY-T1-E3

Vishay / Siliconix

Tape & Reel (TR) Hot Swap Controllers SOIC

SOT-23

SI9707DY-T1-E3 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mount Surface Mount
Package / Case SOIC
Number of Pins 16
Packaging Tape & Reel (TR)
JESD-609 Code e3
Pbfree Code yes
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 16
Terminal Finish Matte Tin (Sn)
Max Operating Temperature 85°C
Min Operating Temperature -40°C
Subcategory Power Management Circuits
Technology CMOS
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 5V
Time@Peak Reflow Temperature-Max (s) 40
Pin Count 16
Number of Outputs 2
Supply Voltage-Max (Vsup) 5.5V
Power Supplies 3.3/5V
Temperature Grade INDUSTRIAL
Supply Voltage-Min (Vsup) 4.5V
Analog IC - Other Type ANALOG CIRCUIT
Length 9.9mm
Height Seated (Max) 1.75mm
Width 3.9mm
Radiation Hardening No
RoHS Status RoHS Compliant
SI9707DY-T1-E3 Product Details

SI9707DY-T1-E3 Overview


There is a SOIC package that includes this.The package resembles a Tape & Reel (TR).In total, it has 16 terminations.There is a DUAL terminal position on the device.A total of 16 pins are present on it.A supply voltage of 5V allows for high efficiency.This device uses 16 pins for operation.There is nothing else in Power Management Circuits but this gadget.Surface Mount directs its position.Operating at 85°C°C allows for stable operation.Maintaining reliability requires a minimum working temperature of -40°C degrees Celsius.For normal operation, Vsup should be maintained above 4.5V.In the Vsup (maximum supply voltage) setting, 5.5V is selected.Hot-swappable device is 3.3/5V type power supplies that are used in this part.Analog IC ANALOG CIRCUIT is used in this gadget.By default, it produces output 2.

SI9707DY-T1-E3 Features


The terminal position of 16


SI9707DY-T1-E3 Applications


There are a lot of Vishay / Siliconix
SI9707DY-T1-E3 hot swap controllers applications.


  • Datacom
  • Electric vehicle
  • Avionics systems
  • Safe board insertion and extraction
  • Industrial computers and servers
  • Redundant-array-of-independent-disk (RAID) storage
  • Other forms of communications infrastructure
  • Board or blade insertion into live backplanes
  • Backplane
  • Loads

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