XC6SLX75T-2FG676C Overview
Fpga chips is supplied in the BGA package. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. Fpga chips is programmed wFpga chipsh 348 I/Os for transferring data in a more coherent manner. There are 74637 logic elements/cells to form a fundamental building block. Fpga chips is powered from a supply voltage of 1.2V. There are 320 outputs incorporated in this device. Fpga chips is designed wFpga chipsh 676 terminations. The RAM si387kBe of this FPGA module reaches 387kB to ensure normal operation of the program. Fpga electronics is designed wfpga electronics h 676 pins. As long as this FPGA is mounted in Surface Mount, it could work fantastically according to its specifications. When operating with the supply voltage of 1.2V, designers can fully make use of its flexibility. The maximal operating temperature of this module reaches 85°C. The operating temperature should be higher than 0°C. Fpga semiconductor is equipped wfpga semiconductorh 676 pin count. Its basic building block is composed of 5831 logic blocks (LABs). Typically, fpga semiconductor uses a crystal oscillating at 667MHz . There are 93296 registers used to store and transfer data.
XC6SLX75T-2FG676C Features
348 I/Os
676 LABs/CLBs
85°C gates
5831 logic blocks (LABs)
93296 registers
XC6SLX75T-2FG676C Applications
There are a lot of Xilinx
XC6SLX75T-2FG676C FPGAs applications.
- Digital signal processing
- Bioinformatics
- Device controllers
- Software-defined radio
- Random logic
- ASIC prototyping
- Medical imaging
- Computer hardware emulation
- Integrating multiple SPLDs
- Voice recognition
