XA3S400A-4FTG256I Overview

There are two packages that contain fpga chips: 256-LBGA package and X package. Having 195 I/Os makes data transfers more coherent. A fundamental building block consists of 8064 logic elements/cells. This FPGA module can be attached to the development board with a Surface Mount. There is a 1.14V~1.26V-volt supply voltage required for the device to operate. It is a type of FPGA belonging to the Automotive, AEC-Q100, Spartan?-3A XA seies. Fpga chips is necessary to keep the operating temperature wFpga chipshin -40°C~100°C TJ when the device is operating. It is for space saving reasons that this FPGA model is contained in Tray. There are 368640 RAM bits that are available with this device. For related parts, use its base part number XA3S400A. The FPGA module's RAM si45kBe reaches 45kB in order to ensure that the program operates in a normal manner. 256 pins are designed into the device. 896 LABs/CLBs are configured on this FPGA. In my opinion, this FPGA could produce fantastic results if mounted in Surface Mount, provided that its specifications are followed. The 1.2V supply voltage provides designers with full flexibility in their designs. In this module, 100°C is the maximum operating temperature at which fpga electronics can operate. Operating temperatures should exceed -40°C. 400000 gates make up the basic block of its construction. There are 896 logic blocks (LABs) that make up the system's basic building block. 256-FTBGA (17x17) stands for its supplier device package.

XA3S400A-4FTG256I Features

195 I/Os
Up to 368640 RAM bits
256 LABs/CLBs
100°C gates
896 logic blocks (LABs)

XA3S400A-4FTG256I Applications

There are a lot of Xilinx Inc. XA3S400A-4FTG256I FPGAs applications.

• Computer hardware emulation
• Data center search engines
• Data Center
• Medical imaging
• Solar Energy
• Artificial intelligence (AI)
• Aerospace and Defense
• Broadcast
• Industrial,Medical and Scientific Instruments
• Cryptography