XA7S75-2FGGA484I Overview

There are two packages that contain fpga chips: 484-BGA package and X package. Fpga chips is programmed wFpga chipsh 338 I/Os for transferring data in a more coherent manner. A fundamental building block consists of 12000 logic elements/cells. The Surface Mount-slot on the development board allows you to attach the FPGA module. This device is powered by a 0.95V~1.05V battery. There are many types of FPGAs in the Automotive, AEC-Q100, Spartan?-7 XA series, this is one of them. Fpga chips is important to maintain the operating temperature wFpga chipshin the range of -40°C~100°C TJ when operating the machine. Having a RAM bit size of 3317760 means that this device will offer you a lot of memory. 6000 LABs/CLBs are configured on this FPGA.

XA7S75-2FGGA484I Features

338 I/Os
Up to 3317760 RAM bits

XA7S75-2FGGA484I Applications

There are a lot of Xilinx Inc. XA7S75-2FGGA484I FPGAs applications.

• Wireless Communications
• Server Applications
• ADAS
• Industrial Ethernet
• Military Temperature
• Data Mining
• Space Applications
• High Performance Computing
• Defense Applications
• Broadcast