XCKU3P-2FFVA676I Overview

There are two packages that contain fpga chips: 676-BBGA, FCBGA package and X package. In this kind of FPGA, FIELD PROGRAMMABLE GATE ARRAY is used. Fpga chips is programmed wFpga chipsh 256 I/Os for transferring data in a more coherent manner. The basic building blocks of logic contain 355950 logic elements/cells. An attachment Surface Mount allows the FPGA module to be attached to the development board. Fpga chips operates at a voltage of 0.825V~0.876V and uses a battery to supply power. An FPGA belonging to the Kintex? UltraScale+? series is referred to as an FPGA. Operating temperatures should be maintained within the -40°C~100°C TJ range at all times when the unit is in use. This FPGA model is contained in Tray for space saving. Fpga electronics is worth mentioning that this device provides 31641600 bfpga electronics s of RAM. A total of 20340 LABs/CLBs make up this FPGA array.

XCKU3P-2FFVA676I Features

256 I/Os
Up to 31641600 RAM bits

XCKU3P-2FFVA676I Applications

There are a lot of Xilinx Inc. XCKU3P-2FFVA676I FPGAs applications.

• Enterprise networking
• Secure Communication
• High Performance Computing
• Radar and Sensors
• Distributed Monetary Systems
• Solar Energy
• Space Applications
• Data Center
• ASIC prototyping
• Automation