484 Terminations -40°C~125°C TJ System On Chip Zynq® UltraScale+™ MPSoC EG Series 128 I/O 0.85V
SOT-23
XAZU2EG-1SBVA484Q Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
11 Weeks
Package / Case
484-BFBGA, FCBGA
Surface Mount
YES
Operating Temperature
-40°C~125°C TJ
Packaging
Tray
Series
Zynq® UltraScale+™ MPSoC EG
Part Status
Active
Number of Terminations
484
HTS Code
8542.31.00.01
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Supply Voltage
0.85V
Terminal Pitch
0.8mm
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
JESD-30 Code
S-PBGA-B484
Number of I/O
128
Speed
500MHz, 1.2GHz
RAM Size
1.2MB
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR CIRCUIT
Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals
DMA, WDT
Connectivity
CANbus, I2C, SPI, UART/USART, USB
Architecture
MPU, FPGA
Primary Attributes
Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Length
19mm
Height Seated (Max)
2.61mm
Width
19mm
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1
$626.07000
$626.07
500
$619.8093
$309904.65
1000
$613.5486
$613548.6
1500
$607.2879
$910931.85
2000
$601.0272
$1202054.4
2500
$594.7665
$1486916.25
XAZU2EG-1SBVA484Q Product Details
This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor(s).
A core processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 is used to build this SoC.Its package is 484-BFBGA, FCBGA.A 1.2MB RAM SoC chip provides reliable performance to users.Internally, this SoC design uses the MPU, FPGA technique.A system on chip SoC of this type belongs to the Zynq® UltraScale+™ MPSoC EG series.For this SoC meaning, the average operating temperature should be -40°C~125°C TJ.A key point to note is that this SoC security combines Zynq®UltraScale+™ FPGA, 103K+ Logic Cells.It comes in a state-of-the-art Tray package.Total I/Os on this SoC part are 128.A 0.85V power supply should be used.Having 484 terminations in total makes system on a chip possible.This wireless SoC uses MICROPROCESSOR CIRCUIT as its uPs, uCs, and peripheral ICs.
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 processor.
1.2MB RAM. Built on MPU, FPGA. MICROPROCESSOR CIRCUIT
There are a lot of Xilinx Inc.
XAZU2EG-1SBVA484Q System On Chip (SoC) applications.